Memory can be segmented into five markets in 3C product applications
Time：2017-06-24 Source：
Memory is an important category of semiconductors. The global market share of semiconductor memory is expected to reach $155.458 billion in 2022, accounting for 25.34% of the global semiconductor market. The total global data storage demand is projected to increase from 41ZB in 2019 to 175ZB by 2025, representing a more than fourfold growth during this period.
Memory is most widely used in 3C (computer, communication, and consumer electronics) products, which can be subdivided into five major markets.
First, the Internet of Things (IoT). In recent years, there has been a significant demand for small-capacity memory in the IoT. Besides IoT MCUs, the rise of the wearable market has also driven the development of NOR Flash and NAND Flash, as Bluetooth headphones and smart wristbands/watches require data storage.
Second, the big data center. The big data center will utilize high-capacity storage devices to store vast amounts of data
Third, automotive electronics. For systems or components such as vehicle dashboards, ADAS, charging piles, and V2X, small-capacity storage devices are required to store data. Currently, some storage suppliers' data Nor Flash and NAND Flash have been applied in the automotive market.
Fourth, artificial intelligence. Large-capacity memory is commonly used in artificial intelligence, which can promote the development of advanced memory.
Fifth, 5G base stations. In the field of communication, 5G operates in a harsh environment and requires round-the-clock operation. For example, both the BBU (Baseband Processing Unit) and AAU (Active Antenna Unit) of 5G base stations incorporate high-performance and high-reliability SLC NAND Flash.
Compared to foreign memory suppliers, such as Samsung, SK Hynix, Micron, and other large factories, they all adopt the IDM (Integrated Device Manufacturing) approach, which is related to their corporate evolution. In certain sealing and testing stages, they may choose OEM (Original Equipment Manufacturing), but the main production and manufacturing processes are controlled by themselves. Due to the relatively short development time of the domestic memory industry, many memory companies are still in the stage of developing Fabless (Fab-less), including GigaDevice and Dongxin Semiconductor.
